Tacsil F20 Carrier Tape
A cost effective solution to FPC assembly
Tacsil F20 offers a cost effective solution to FPC assembly over conventional methods. Polyimide tapes, resin coated plates and double sided tapes can increase costs, lower productivity, contaminate and/or damage flexible circuitry, reduce print accuracy and create environmental issues. With Tacsil F20, FPC assembly just got easier.
Technical Data
Benefits
• Performs more than 500 cycles in SMT processing
• Excellent dimensional stability at 260 °C
• Precise surface mounting
• No adhesive residue
• Adhesion level of silicone compound can be selected
• Superior surface flatness allows whole area fixation
• Excellent Die-cut properties
• Provides flexibility to carrier designers
Main Applications
• SMT Processing of flexible PCB's
• SMT processing of thin rigid PCB's
• Carrier of LCD mounting process
• Various temporary fixing applications
| Product type | Download Data Sheet | Thickness (MM) | 180 ºC Peel Adhesion of PI Film on Resin Surface (At room temp, N/25mm) | Holding Power (PSA side, 2.2 PSI @ 260 °C x 2hr) | Tensile Strength (N/50mm) |
|---|---|---|---|---|---|
| Tacsil F20 HB, P20 HB | Download | 0.2 ± 0.015 | 0.4 ± 0.05 | No Creep, AF | > 500 |
| Tacsil F20 B, P20 B | Download | 0.2 ± 0.015 | 0.3 ± 0.05 | No Creep, AF | > 500 |
| Tacsil F20 MB, P20 MB | Download | 0.2 ± 0.015 | 0.2 ± 0.05 | No Creep, AF | > 500 |
| Tacsil F20 LB, P20 LB | Download | 0.2 ± 0.015 | 0.1 ± 0.05 | No Creep, AF | > 500 |
| Tacsil P10 HB | Download | 0.1 ± 0.015 | 0.4 ± 0.05 | No Creep, AF | > 200 |
| Tacsil F20 H2, H2B | Download | 0.2 ± 0.015 | 1.3 ± 0.2 | No Creep, AF | > 500 |
| Tacsil F10 H2, H2B | Download | 0.1 ± 0.015 | 1.3 ± 0.2 | No Creep, AF | > 200 |
| Test Method | JIS Z 0237 | JIS Z 0237 | ASTM D 3654 | ASTM D 3759 |
*Available in sheet or roll form.