fastrise™27

Multilayer non-reinforced prepreg

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fastRiseTM27 is designed to bond all manner of circuit boards together with the lowest possible loss of any thermosetting prepreg available today. fastRise™ enables 77 GHz automotive radar.

fastRise™ is non reinforced and eliminates skew/ variation in high speed digital/RF circuits. fastRise™ is based on ceramic, thermoset and PTFE and is ideal for use with Taconic’s TSM-DS3b, TSMDS3M and EZ-IO-F.

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 Benefits:

  • Df= 0.0014 / 0.0017 (10/40 GHz)
  • Laser ablatable, HDI ready
  • Low Dk enables reduced thickness of ATE boards
  • Low temperature alternative to thermoplastic films in military designs
  • Multilayer prepreg for high layer count high speed digital
  • Stable Dk over temperature
  • Fiberglass free prepreg
  • Enables 5+ sequential laminations
  • Compatible with conductive pastes between subassemblies

Applications:

  • Filters & Couplers
  • Military, Avionics, Space
  • Automotive Radar
  • Beam Steerable Antenna
  • Flexible Circuits

 

Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
fastRise25,26,27,28
(FR-27-0045-35)

2.72 +/- 0.04

0.0014 Download Download Download

Lowest loss non-reinforced
prepreg

 

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