TSM-DS3b

Dimensionally Stable Low Loss Laminate

Products

View Product Data Sheet »

TSM-DS3b is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3b is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers.

TSM-DS3b was developed for high power applications (TC: 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3b was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.

 

 Benefits:

  • Industry best DF ( DF: 0.0011 @ 10GHz)
  • High thermal conductivity
  • Low (~5%) fiberglass content
  • Dimensional stability rivals epoxy
  • Enables large format high layer count PWBs
  • Builds complex PWBs in yield with consistency and predictability
  • Temperature stable DK +/- 0.25 (-30°C to 120°C)
  • Compatible with resistor foils

Applications:

  • Couplers
  • Phased Array Antennas
  • Radar Manifolds
  • mmWave Antenna / Automotive
  • Oil Drilling
  • Semiconductor / ATE Testing

 

Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
TSM-DS3b

3.0 +/- 0.04

0.0011 Download Download Download

Dimensionally stable low
loss laminate, rivals epoxy

 

Compare Products »