fastrise™27

Multilayer non-reinforced prepreg

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fastRiseTM27 is designed to eliminate skew in differential transmission lines and eliminate dielectric constant fluctuations caused by fiberglass in filter and coupler applications. This low temperature thermosetting prepreg is based on ceramic, thermoset and PTFE and is ideal for use with Taconic's standard low loss laminates like TSM-DS (Df=0.0010) and TSM-DS3 (Df=0.0011).

 Benefits:

  • Enables 5+ sequential laminations
  • Low Dk enables reduced thickness of ATE boards
  • Low temperature alternative to thermoplastic films in military designs
  • Multilayer prepreg for mmWave applications
  • Stable Dk over temperature
  • Fiberglass free prepreg
  • Laser ablatable

Applications:

  • Semiconductor testing
  • Military
  • mmWave antenna / automotive

 

Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
fastRise27

2.7 +/- 0.1

0.0014 Download Download Download

Lowest loss non-reinforced
prepreg

 

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