Ultra low loss power amplifier substrate


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RF-35A2 is designed with an ultra low fiberglass content to achieve "best in class" insertion loss properties and a homogeneous dielectric constant throughout the laminate.

The uniform dispersion of ceramic throughout the laminate yields extremely low x and y coefficients of thermal expansion. The low modulus and low x-y CTE values make RF-35A2 an attractive material for the surface mounting of chip carriers.

RF-35A2 is manufactured in a proprietary multi-step process that provides excellent dielectric properties along with superior copper peel adhesion.



  • Low loss properties
  • DK tolerance of +/- 0.05
  • Homogeneous DK
  • Excellent peel strength
  • Low moisture absorption
  • Ease of drilling


  • Power amplifiers
  • Filters / couplers
  • High speed digital
  • Multilayer
  • Passive components
  • Wireless antennas


Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
RF-35A2 3.5 +/- 0.05 0.0018 Download Download  Download Ultra low loss power amplifier laminate


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