Ultra low loss power amplifier substrate
RF-35A2 is designed with an ultra low fiberglass content to achieve "best in class" insertion loss properties and a homogeneous dielectric constant throughout the laminate.
The uniform dispersion of ceramic throughout the laminate yields extremely low x and y coefficients of thermal expansion. The low modulus and low x-y CTE values make RF-35A2 an attractive material for the surface mounting of chip carriers.
RF-35A2 is manufactured in a proprietary multi-step process that provides excellent dielectric properties along with superior copper peel adhesion.
- Low loss properties
- DK tolerance of +/- 0.05
- Homogeneous DK
- Excellent peel strength
- Low moisture absorption
- Ease of drilling
- Power amplifiers
- Filters / couplers
- High speed digital
- Passive components
- Wireless antennas
|Product Name||DK+ Tolerance||DF||Data Sheet||Safety Data Sheet||Processing Guidelines||Product Description|
|RF-35A2||3.5 +/- 0.05||0.0011||Download||Download||Download||Ultra low loss power amplifier laminate|