TSM-DS3M

Family of dimensionally stable low loss laminates

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TSM-DS3M is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS3M is a ceramic-filled reinforced material with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers.

TSM-DS3M was developed for high power applications (TC: 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3M was also developed to have very low coefficients of thermal expansion for demanding thermal cycling.

 

 Benefits:

  • Industry best DF ( DF: 0.0011 @ 10GHz)
  • High thermal conductivity
  • Low Z axis expansion for military applications
  • Low (~5%) fiberglass content
  • Dimensional stability rivals epoxy
  • Enables large format high layer count PWBs
  • Builds complex PWBs in yield with consistency and predictability
  • Temperature stable DK +/- 0.25 (-30°C to 120°C)
  • Compatible with resistive foils

Applications:

  • Microstrip and stripline circuitry for military applications
  • Couplers
  • Phased Array Antennas
  • Radar Manifolds
  • mmWave Antenna / Automotive
  • Oil Drilling
  • Semiconductor / ATE Testing

 

Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
TSM-DS3M

2.94 +/- 0.04

0.0011 Download Download Download

Dimensionally stable low
loss laminate, rivals epoxy

 

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