FEP

Bonding agent for stripline circuits

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FEP bonding film is primarily used as a bond agent between two PTFE circuit boards to form a strip line circuit. Other uses include bonding PTFE laminates to ground planes of various metal types and thicknesses. It is often used in conjunction with lower melt point bond films such as CTFE, where limited sequential lamination is possible. The excellent electrical characteristics of this material make it ideal for circuitry designed for the microwave frequency range. The surface of FEP 200-70 is treated for enhanced bonding characteristics. 

Benefits:

  • Low loss bonding film
  • DK flat over temperature

Applications:

  • RF multilayer PCB's

 

Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
FEP

2.0

0.0003 Download Download -

Thermoplastic bonding film

 

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