fastRise™EZpure

Low temperature curing, thermosetting prepreg

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fastRise™EZpure is a low temperature curing adhesive for flexible and rigid PWBs. EZpure is a non-reinforced adhesive containing only a low loss thermosetting resin and ceramic additives. EZpure has been optimized to adhere to difficult-to-bond-to substrates like PTFE, polyimide (DuPont™ Pyralux® AP/TK flexible circuit materials) and LCP.

Benefits:

• FR4 lamination temperatures
• Low DK enables reduced PWB
   thickness for the same impedance
• Thermosetting prepreg will not reflow
• Fiberglass-free prepreg
• Compatible with conventional
   lamination processes
• Can be combined with any core material
• Laser Ablatable

 

Applications:

• High Speed Flex Cables
• Thin Multilayers
• ATE testing
• mmWave Antenna/Automotive
• Bonding of Subassemblies

 

Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
fastRiseEZpure

2.8  

0.0032  Download   Download 

Low temperature curing, 
thermosetting prepreg

 

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