fastrise™7

Thermally stable, high DK, low loss prepreg

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fastRise™7 is a thermally stable, high DK (7.45 at 10 GHz), low loss prepreg designed to enable the manufacture of high dielectric constant stripline structures at low temperatures. fastRise™ 7 prepreg enables stripline manufacture at 420 °F/215 °C, well below the fabrication temperatures of Low Temperature Co-fired Ceramics (LTCC) 

 Benefits:

  • High 7.45 DK organic prepreg
  • Low (420 °F/215 °C) lamination
    enables conventional PWB fabrication
  • Lower cost / reduced weight alternative
    to LTCC
  • Lower cost alternative to fusion bonding
  • Enables miniaturization & densification
    of high DK RF stripline structures
  • Compatible with Ticer/Ohmega resistor foils

Applications:

  • Military and Avionics (weight reduction)
  • Radar Manifolds, Antennas, Fire control
  • Filters, Couplers, Power Amplifiers
  • Phase Matching Networks

 

Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
fastRise7

7.45

0.0030 Download Download Download

High DK, low loss
glass-reinforced prepreg

 

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