EZ-IO-F

Spread Weave Next Generation Laminate

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EZ-IO-F is a thermally stable composite based on nanotechnology, spread weave and PTFE. Nanoparticle silica insures a drill quality on par with FR4 materials. EZIO-F is based on a very low (~10 wt%) fiberglass content. The nature of the spread weave provides a uniform dielectric constant and impedance as suggested by skew testing.

EZ-IO-F was created for the next generation of digital circuitry where digital transmission speeds start at 25 gbps and reach 112 gbps. EZ-IO-F was also designed for microwave applications operating at increasingly higher frequencies where there is a need to combine both digital and microwave circuitry onto one PWB. EZIO-F was developed to challenge the best FR4 materials at the fabricator level in the most difficult 30-40 layer digital applications.

 

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 Benefits:

  • Extremely low skew
  • Nanotechnology based PTFE laminate
  • Drill quality of FR4 (1000+ hits/bit)
  • Registration of FR4
  • Extremely low fiberglass content (~10%)
  • <0.18% DK variation within a lot
  • Temperature stable DK
  • Capable of 40+ layer large format PWBs
  • CAF Resistant

Applications:

  • Semiconductor testing at 25 gbps and higher
  • Test and measurement
  • Optical data transport & backplane routers
  • Hybrid FR4 PWBs combining microwave &
    digital signals
  • Space and defense


Product Name DK+ ToleranceDFData SheetSafety Data SheetProcessing GuidelinesProduct Description
EZ-IO-F 2.8, 2.77 +/- 0.05 0.0015, 0.0014 Download - - Thermally stable composite
based on nanotechnology, spread weave and PTFE

 

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