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    July 31, 2009
    Taconic Announces Asset Purchase of Alphaglas(R) Product Line

    July 2007
    U.S. Industry Today Taconic Feature: "Advanced Materials Engineering"

    April 2007
    Global SMT & Packaging Feature: "Carrier Tape for Lead-Free Assembly of FPCBs"

    April 27, 2007
    Taconic’s TacWeld 69 is as tough as nails for PVC window fabrication

    November 7, 2006
    Taconic Brazil Celebrates Grand Opening

    September 1, 2006
    Taconic Introduces Longer-Life Carrier Tapes for SMT Process



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    Taconic Advanced Dielectric Division Announces Launch of Low-Loss Bromine-Free Prepregs and Laminates

    August 25, 2005 - Taconic announces the expansion of the TacPreg®/TacLam family of products by offering low-loss bromine-free prepregs and laminates. The new family of “green” materials, TLG-29 & 30, was designed with lower dissipation factor (df = 0.0030 to 0.0038 at 10 GHz – thickness dependant). The TLG family of products was designed for the military, RF, and high speed digital markets, where a homogeneous dielectric constant throughout the laminate is desirable.

    “TLG-29 & 30 reduce the need for thermoplastic films in the military markets, provide the digital market with homogenous products reducing skew in high speed data transmission, and offer the RF marketplace a material set that can be foil laminated when designing low loss/low cost multilayers. We are excited that we were able to improve the product line to benefit each of these markets while at the same time become WEEE & RoHS compliant by removing any source of bromine,” said Dr. Thomas F. McCarthy, Director of Engineering and Product Manager for the TacPreg®/TacLam family of products.

    TLG-29 & 30 were designed and beta tested on thick backpanels with the intent to improve the ease of fabrication in difficult designs.

    Tom McCarthy can be reached at Taconic Headquarters at 518-658-3202 x 265 or tomm@4taconic.com.
    Tel: +518-658-3202/800-833-1805 © Copyright 2005 by Taconic. Update: 9/20/06