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Multilayer Lamination Methods for PTFE-Based PCBs
Board designers are continually looking for ways to save weight and space in their applications and are moving toward higher count multilayer designs to solve these issues. Historically, PTFE multilayer designs have limited the number of layers within the design due to the ability of board shops to laminate PTFE designs with high layer counts. This article will review the different types of applications, bonding films and prepregs, equipment needs, and bonding methods that can be used to produce low and high count PTFE multilayer boards.
All four general types of PTFE multilayers will be reviewed:
· Single lamination, all PTFE based laminates
· Single lamination, mixed dielectrics
· Sequential lamination, all PTFE based laminates
· Sequential lamination, mixed dielectrics
Key words: PTFE multilayer lamination, rf, digital, single lamination, sequential lamination, fusion bonding, CTFE, FEP, thermoset prepregs, TacPreg, TacBond HT1.5
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