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Microwave Multilayer PCBs
Over the last 30 years we have seen a lot of different designs design on microwave printed circuit boards. The one area of microwave board design that has changed is the design and use of multilayer printed circuits boards. Traditionally multilayer boards for microwave applications have been made with etching off the copper on a piece of microwave material and using a 1.5 mil thick bonding film, bonding it to another dielectric layer. With the introduction of new low loss prepregs, engineers can now design multilayer microwave boards which use more traditional printed circuit board manufacturing processes. This paper will look at the history of multilayer microwave boards from clamping to bonding films and to today’stodays use of microwave prepregs. The paper will finish up with a material cost comparison of the construction types from using bonding films, prepregs to and foil lam constructions.
Key words: microwave multilayer, RF-35, TacPreg, TacBond HT1.5
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