TSM-DS and TSM-DS3 RF Substrate RF60A - Taconic Advanced Dielectric Division



	TSM-DS Family of Dimensionally Stable Low Loss Laminate Characteristics Industry best Df (Df: 0.0010/0.0011 [DS/DS3] @10 GHz) High thermal conductivity (DS3: 0.65 W/mK) Low (~5%) fiberglass content Dimensional stability rivals epoxy Enables large format high layer count PWBs Builds complex PWBs in yield with consistency and predictability Temperature stable DK +/- 0.35% (-30 to 120ºC) Compatible with resistor foils Applications* Couplers Phased Array Antennas Radar Manifolds mmWave Antenna/Automotive Oil Drilling Semiconductor/ATE Testing Introducing TSM-DS The TSM-DS family is comprised of thermally stable, industry leading low loss cores (Df = 0.0010/0.0011 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. The TSM-DS family is ceramic-filled reinforced materials with very low fiberglass content (~ 5%) that rival epoxies in fabricating large format complex multilayers. TSM-DS3 was developed for high power applications (TC: 0.65 W/m*K) where it is necessary for the dielectric material to conduct heat away from other heat sources in a PWB design. TSM-DS3 was also developed to have very low coefficients of thermal expansion for demanding thermal cycling. The TSM-DS family of cores combined with fastRise™27 (Df: 0.0014 @ 10 GHz) prepreg is an industry leading solution for the lowest possible dielectric losses that can be attained at epoxy-like 390 - 420 ˚F (200 - 215 ˚C) fabrication temperatures. The low insertion losses of TSM-DS/fastRise™27 are only rivaled by fusion bonding (the melting of pure Teflon® laminates from 550 - 650˚F, 288 - 343˚C). Fusion bonding is expensive, it causes excessive material movement and it puts stress on plated through holes. For complex multilayers, the price of poor yield drives up the final material cost. fastRise™27 enables the sequential lamination of TSM-DS at low 390˚F to 420˚F (200 - 215 ˚C) with consistency and predictability that reduces cost. For microwave applications, the low x, y and z CTE values ensure that critical spacings between traces in filters and couplers have very low movement with temperature. The TSM-DS family can be used with very low profile copper foils yielding a smooth copper edge between coupled lines. Registration over many layers is critical for yield and variations in copper weight and copper etching across a panel can cause nonlinear movement. Non-linear movement over large panels leads to a lack of registration of the drilled hole to the pad and possibly open circuits. TSM-DS is compatible with Ticer and Ohmega resistor foils. Typical TSM-DS and TSM-DS3 Values TSM-DS and TSM-DS3 Data Sheet Download "Strategies for Designing Microwave Multilayer PCBs Using Stripline Structures Download "TSM-DS Multilayer PCBs Manufactured With Various Prepregs - fastRise 27, HT 1.5, Speedboard C and FEP" Back to Products Overview