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FEP 200-70 RF Bonding Film
Characteristics
Low loss bonding film
DK flat over temperature
Applications
RF multilayer pcbs
Introducing FEP 200-70
FEP is commonly used for bonding PTFE multilayer printed circuits. The primary use is
as a bond agent between two PTFE circuit boards to form a stripline circuit. Other uses include bonding
PTFE laminates to ground planes of various metal types and thicknesses. Used in conjunction with
lower melt point bond films such as CTFE, limited sequential lamination is possible.
The excellent electrical characteristics of this material make it ideal for circuitry designed for the
microwave frequency range. The surface of FEP 200-70 is treated for enhanced bonding characteristics.
 Data Sheet
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